Call for Papers
Call for Papers
- Advanced Silicon Devices
- Compound Semiconductor Devices
- Advanced Process Technologies
- Device Modeling & Simulation
- Process Modeling & Simulation
- High-Speed Optoelectronic Devices
- Silicon Photonics & Integration
- Photonic Sensors & Image Sensors
- Optical Computing Devices
- Display Devices
- Advanced Memory Technologies
- Non-volatile Memory
- SRAM & DRAM
- 3D Memory Technologies
- Processing-in-Memory Techniques
- Biomedical Sensors & Biosensor
- MEMS based Sensors & Actuators
- Chemical Sensors
- Sensor Interfaces
- Smart/Intelligent Sensors & Actuators
- Silicon Based Power Devices
- Compound Semiconductor Based Power Devices
- Power Device Reliability
- Power Management Integrated Circuits & Systems
- On-Chip Power Delivery and Management
- Microwave, Millimeter Wave Devices & Circuits
- Wireless System Building Blocks
- ADC/DACs for Wireless Systems
- Nonlinear Circuits for Wireless Systems
- Integrated Passive Device & Circuits
- Clock & Frequency Synthesizers for Wireline Interface
- Serializer/Deserializer Circuits
- DSP based High Speed Interface
- Die-to-Die & Chip-to-Chip Interface
- Ultra-High Speed Short-Range Transmission Technology
- Digital Blocks & Circuits
- Digital Signal Processing Integrated Circuits & Systems
- FPGA Circuits Design & Application
- Processors, Accelerators & SoCs
- Advanced Computing Integrated Circuits & Systems
- 2.5D & 3D Integration
- Chiplet Design and Heterogeneous Integration Packaging
- Advanced Wire Bonding Technology
- Modeling and Simulation for Advanced Packaging
- Testing and Reliability in Advanced Packaging
- Design for Testability, Reliability & Manufacturability
- Modelingļ¼Simulation & Emulation
- Design & Technology Co-Optimization
- High Level Synthesis & Design-Automatic
- Artificial Intelligence Algorithms for EDA