Zhuojun Chen (Senior Member, IEEE) received the Ph.D. degree in integrated circuit design from the Institute of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Beijing, China, in 2017. In 2017, he joined Hunan University, Changsha, China, where he was an Assistant Professor at the School of Physics and Electronics. He is currently a Professor with the College of Semiconductors (College of Integrated Circuits), Hunan University. His current research interests include analog/mixed-signal integrated circuit and domain-specific accelerator design. Dr. Chen was a recipient of several design and teaching awards.

Speech Title: High-precision Voltage and Frequency Reference Circuits

Run Min is a professor from Huazhong University of Science and Technology. He is a national youth talent, top youth talent of Hubei Province, Distinguished Scholar of HUST, and Senior Member of IEEE. Focusing on the applications of aerospace and automotive, he devotes himself to the research of high-reliability power driver ICs and high-power-density power supplies. In recent years, he has directed over 3 projects funded by the National Natural Science Foundation of China, 2 KGJ projects, 8 aerospace projects. His developed chips have been mass-produced and applied in satellites and Dongfeng Motor vehicles (Mengshi, eπ, Aeolus), for which he was awarded the "Excellent Chip Contribution Award" by Dongfeng Motor. He has published more than 30 SCI papers, among which 16 papers were published as the first/corresponding author in journals and conferences including IEEE JSSC, CICC, TPEL, TIE, TCAS-I and APEC. He has been granted 10 invention patents. He serves as a senior reviewer for journals such as IEEE TPEL, TIE, JESTPE and TCAS-I, and was awarded the Outstanding Reviewer Award from IEEE TPEL.

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Jian Zhao (S’14, M’17, SM’21) received his Ph.D. degree from the School of Mechanical Engineering, Nanjing University of Science and Technology, China, in 2017. He served as a visiting scholar in the VLSI and Signal Processing Lab at the National University of Singapore from 2012 to 2015. From 2017 to 2019, he joined the Department of Electronic Engineering, Tsinghua University, as a postdoctoral researcher. He is currently an Associate Professor in the School of Integrated Circuits, Shanghai Jiao Tong University, China. His research interests include biomedical and bio-inspired circuits and systems. He has authored and co-authored over 80 technical papers and 2 book chapters. He is the recipient of the IEEE BioCAS 20th Anniversary Top WiCAS/YP Contributor Award, the ISCAS 2024 Best Demonstration Award, and the ICTA 2021 Best Paper Award. He has also served as an Associate Editor for the IEEE Transactions on Biomedical Circuits and Systems (TBioCAS) and IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), he received the TCAS-I Best Associate Editor Award in 2021. He is selected as IEEE CASS distinguished lecturer from 2025.

Speech Title: Towards Flexible Biomedical Systems: Circuits and Design on Thin-film Transistors

Professor Hua Fan, Young Changjiang Scholar of the Ministry of Education，IEEE Senior Member. Now, Hua Fan is the Associate Editor of IEEE TCAS-I and TCAS-II, she is president of IEEE Woman in Engineering (WIE) Chengdu chapter. She received the Ph.D. degree from Tsinghua University, and has been a Professor of University of Electronic Science and Technology of China since July 2021.

Speech Title: Research on Key Technologies of CMOS Three-Axis Hall Sensors
Abstract: Compared with conventional horizontal Hall devices, which can only sense the magnetic field perpendicular to the device surface, three-axis Hall devices can simultaneously detect the magnetic field in the x, y, and z directions at a single point, making them suitable for applications involving magnetic field vector detection. Owing to the advantages of long service life and high reliability brought by non-contact measurement, monolithic three-axis Hall sensors are particularly widely used in angle measurement. They can detect the angular orientation of a magnet rotating around the sensor’s central axis and realize full 360° angle measurement, which is applied in fields such as missile launch angle control, unmanned aerial vehicles, joysticks, robotics, and automotive electronics.
Conventional three-axis Hall sensors employ three horizontal Hall devices aligned along the respective coordinate axes to be measured, while requiring the three independently operating Hall devices to be placed in close physical proximity. This fabrication approach for three-axis sensors is extremely difficult and costly. Horizontal Hall devices can only measure the magnetic field perpendicular to the device surface, whereas vertical Hall devices can measure the magnetic field parallel to the device surface. Therefore, the combination of horizontal and vertical Hall devices provides a feasible solution for the measurement of three-dimensional spatial magnetic fields.

Yuhao Zhang is currently a Full Professor with the Department of Electrical and Computer Engineering of the University of Hong Kong (HKU). He also serves as the Associate Director of the HKU Centre for Advanced Semiconductors and Integrated Circuits. Before joining HKU, he was the Shirish S. Sathaye Associate Professor with Virginia Tech, leading the power semiconductor research at the Center for Power Electronics Systems, the largest academic research center in power electronics in the U.S. He received his Ph. D. and S. M., both in electrical engineering from Massachusetts Institute of Technology (MIT) in 2017 and 2013, respectively. He has authored over 200 papers (including 7 Nature/Science-series papers, 21 IEDM papers, 20+ T-PEL papers as the corresponding author) and 2 book chapters and holds 8 granted U. S. patents. He is a co-author of over 10 highlight/feature/prize papers. His work has been cited over 13,000 times with a h-index of 59 and been widely covered by Nature Electronics, Semiconductor Today, Compound Semiconductors, EE Times, etc. over 100 times. He currently serves as the Chair of the Power Devices and ICs Technical Committee of the IEEE Electron Device Society, an Associate Editor-in-Chief for IEEE Electron Device Letters, an Associate Editor for IEEE Transactions on Power Electronics, and the TPC member of many conferences (e.g., IEDM, APEC, WiPDA). He received the MIT Microsystems Technology Laboratories Doctoral Dissertation Award, two IEEE George Smith Awards (best paper award of the year in IEEE Electron Device Letters), four Technical Highlights of IEEE International Electron Devices Meeting (IEDM), IEEE William M. Portnoy 1st Prize Paper Award, the National Science Foundation CAREER Award, the Outstanding New Assistant Professor Award and Faculty Fellow Award of Virginia Tech, the Office of Naval Research Young Investigator Award, the Compound Semiconductor Week Young Scientist Award, and the He Xiang Jian Young Scientist Award. His students received the Ph.D. Thesis Talk Award of the IEEE Power Electronics Society and several APEC Best Presentation Awards.

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Kemeng Yang received the Ph.D. degree in microelectronics and solid-state electronics from the Nanjing University of Posts and Telecommunications (NJUPT), Nanjing, China, in 2020. She worked as a Postdoctoral Fellow with University of Electronic Science and Technology of China from 2020 to 2022, and in 2023, she joined NJUPT as an Associate Professorr. She has published more than 30 high-level papers and obtained 28 granted patents. Her research focuses on the silicon power devices, wide-bandgap power devices, and power integrated circuits.

Speech Title: High-Voltage GaN Power Devices and Modeling Techniques

Dr Xie is currently VP of HMT & CTO of advanced packaging. Dr.Xie received his BS & MS from TsingHua University, China & his PhD degree from University of Colorado at Boulder. He has over 30 years of experience in packaging & held various engineering & management positions at Intel, FCI & TFME. He managed & participated in the development & production of many packaging technology & products in applications in computing, memory, communication & consumer areas. Dr.Xie is a senior member of IEEE. He holds 35 US patents & over 12 Chinese patents. He published over a dozen papers in IEEE & ASME journals.

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Research leader in metrology development and application from a leading 300mm silicon wafer supplier. Eight year experience in application of silicon wafers in various IC products. Ph.D in surface science focused on semiconductor materials. Master and bachelor in condensed matter physics.

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