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Scope

Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas)

Theme 1: Process & Technologies

Track 1：Semiconductor Process Technologies

  • Compound Semiconductor Materials & Technologies
  • Advanced Memory Materials & Technologies
  • Advanced Process Technologies
  • Advanced Interconnect Technologies
  • Process Modeling & Simulation

Track 2：Optoelectronics and Silicon Photonics Integration

  • High-Speed Optoelectronic Devices
  • Silicon Photonics & Integration
  • Photonic Sensors & Image Sensors
  • Optical Computing Devices
  • Display Process & Integration

Track 3：Packaging Technologies

  • 2.5D & 3D Integration
  • Heterogeneous Integration Packaging
  • Advanced Wire Bonding Technology
  • Modeling and Simulation for Advanced Packaging
  • Testing and Reliability in Advanced Packaging

Theme 2: Devices

Track 4：Sensors & Actuators

  • Biomedical Sensors & Biosensor
  • MEMS based Sensors & Actuators
  • Chemical Sensors
  • Sensor Interfaces
  • Smart/Intelligent Sensors & Actuators

Track 5：Power Devices & Power IC

  • Silicon Based Power Devices
  • Compound Semiconductor Based Power Devices
  • Power Device Reliability
  • Power Management Integrated Circuits & Systems

Track 6：Device Reliability & Security

  • Device Modeling & Simulation
  • Back-End of Line Reliability & ESD
  • Aging & Remaining Useful Lifetime Prediction
  • PUF & Hardware Security
  • Devices Radiation Reliability

Theme 3: RFIC & Analog IC

Track 7：Wireless Integrated Circuits & Systems

  • Microwave, Millimeter Wave Devices & Circuits
  • Wireless System Building Blocks
  • Transceiver Chipsets for Communications and Radar
  • Nonlinear Circuits for Wireless Systems
  • Integrated Passive Device & Circuits

Track 8：Wireline Integrated Circuits & Systems

  • Clock & Frequency Synthesizers for Wireline Interface
  • Serializer/Deserializer Circuits
  • DSP based High Speed Interface
  • Die-to-Die & Chip-to-Chip Interface
  • Ultra-High Speed Short-Range Transmission Technology

Track 9：General Analog and Mixed-Signal ICs

  • Amplifiers and Analog Front-Ends
  • Noise-Shaping and SAR-Based ADCs
  • High-Frequency ADCs & DACs
  • Analog Circuits Modeling & Simulation
  • Oscillators & Regulators

Theme 4: Digital IC & System Level Design

Track 10：Digital Integrated Circuits & Systems

  • Digital Blocks & Circuits
  • Digital Signal Processing Integrated Circuits & Systems
  • FPGA Circuits Design & Application
  • Processors, Accelerators & SoCs
  • Advanced Computing Integrated Circuits & Systems

Track 11：Memories

  • Non-volatile Memory
  • SRAM & DRAM
  • 3D Memory Technologies
  • Processing-in-Memory Techniques
  • Memory Testability & Reliability

Track 12：Design Methodology & EDA Technology

  • Design for Testability, Reliability & Manufacturability
  • Modeling, Simulation & Emulation
  • Design & Technology Co-Optimization
  • High Level Synthesis & Design Automation
  • Artificial Intelligence Algorithms for EDA

Contact

Conference Secretary: Ms. Joyce, Email: ieeeicsict@outlook.com

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