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Scope

Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas)

Theme 1: Digital & System Level IC

Track 1：Digital Integrated Circuits & Systems

  • FPGA Circuits Design & Application
  • Processors, Accelerators & SoCs
  • Memory System & Process in Memory
  • System Level Testability & Reliability

Track 2：Digital Circuits

  • Digital Blocks
  • Logical/Physical-Level Security
  • Non-volatile Memory & Volatile Memory
  • Circuit Level Reliability Design

Track 3：Design Methodology & EDA

  • Design for Testability, Reliability & Manufacturability
  • Modeling，Simulation & Emulation
  • Design & Technology Co-Optimization
  • Artificial Intelligence Algorithms for EDA

Theme 2: Analog

Track 4：RF & Wireless

  • Building Blocks at RF, mm-wave and THz
  • Rx, Tx or TRx for Wireless Systems
  • Wireless Sensor, Radar, Imager
  • Device/Packaging/Modeling at RF, mm-wave and THz

Track 5：Wireline

  • Electrical/Optical Transmitters/Receivers for Wireline
  • Clock Generation and Distribution Circuits
  • Building Blocks for High-Speed Wireline Communications

Track 6：General Analog

  • Advanced Analog Circuits
  • High-Speed, High-Precision Data Converters
  • Imagers, Medical Devices & Display Systems
  • Efficient Power Management Circuits

Theme 3: Devices

Track 7：CMOS Logic Devices & Sensors

  • Advanced CMOS Logic Devices
  • 2D & Thin Film Devices & Technologies
  • Flash & Non-Volatile & 3D Memory Technologies
  • Sensor, Sensing Microsystem, MEMS, and Bioelectronics
  • Smart/Intelligent Sensors & Actuators
  • Device Modeling & Simulation

Track 8：Power Devices & Power IC

  • Silicon-based Power Devices
  • Wide Bandgap Power Devices
  • Power Integrated Circuits、modules & Systems
  • Power Integrating & Packaging Technology
  • Power Device Reliability
  • Power Device Modeling & Simulation

Track 9：Device Reliability & Security

  • Back-End of Line Reliability & ESD
  • Aging & Remaining Useful Lifetime Prediction
  • PUF & Hardware Security
  • Devices Radiation Reliability

Theme 4: Process & Technologies

Track 10：Semiconductor Process Technologies

  • Compound Semiconductor Materials & Technologies
  • Advanced Memory Materials & Technologies
  • Advanced Process Technologies
  • Advanced Interconnect Technologies
  • Process Modeling & Simulation

Track 11：Optoelectronics and Silicon Photonics Integration

  • High-Speed Optoelectronic Devices
  • Silicon Photonics & Integration
  • Photonic Sensors & Image Sensors
  • Optical Computing Devices
  • Display Process & Integration

Track 12：Packaging Technologies

  • 2.5D & 3D Integration
  • Heterogeneous Integration Packaging
  • Advanced Wire Bonding Technology
  • Modeling and Simulation for Advanced Packaging
  • Testing and Reliability in Advanced Packaging

Contact

Conference Secretary: Ms. Joyce, Email: ieeeicsict@outlook.com

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