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Technical Program Committee

Technical Program Committee Chairs

Haruo Kobayashi, Gunma University, Japan
Ming Li, Peking University, China
Bo Zhang, University of Electronic Science and Technology of China, China
Yi Zhao, East China Normal University, China

Technical Program Committee Co-Chairs

Bei Yu, The Chinese University of Hong Kong, China
Zheng Wang, University of Electronic Science and Technology of China, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia
Ling Zhang, Zhejiang University, China
Chaoyu Yang, Peking University, China
Jing Jin, Shanghai Jiao Tong University, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Digital & System Level IC Subcommittee

Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China
Track 1：Digital Architectures & Systems
Chair: Zhiyi Yu Sun Yat-sen University, China
Co-Chairs: Yaoyu Tao Peking University, China Hongyang Jia Tsinghua University, China
Track 2：Digital Circuits
Chair: Yongpan Liu Tsinghua University, China
Co-Chairs: Yanan Sun Shanghai Jiao Tong University, China Fengbin Tu Hong Kong University of Science and Technology, China
Track 3：Design Methodology & EDA
Chair: Jun Yang Southeast University, China
Co-Chairs: Yibo Lin Peking University, China Yu Li Zhejiang University, China

Analog Subcommittee

Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China
Track 4: RF & Wireless
Chair: Keping Wang Tianjin University, China
Co-Chairs: Jian Pang Shanghai Jiao Tong University, China Kai Tang Hunan University, China
Track 5: Wireline
Chair: Xiaoyan Gui Xi'an Jiaotong University, China
Co-Chairs: Bingyi Ye East China Normal University, China Yuekang Guo Shanghai Jiao Tong University, China
Track 6: General Analog
Chair: Lin Cheng University of Science and Technology of China, China
Co-Chairs: Junmin Jiang Southern University of Science and Technology, China Ang Hu Huazhong University of Science and Technology, China

Devices Subcommittee

Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair: Jin Wei, Peking University, China
Track 7：CMOS Logic Devices & Sensors
Chair: Heng Wu Peking University, China
Co-Chairs: Wang Kang Beihang University, China Xiaosheng Zhang University of Electronic Science and Technology of China, China
Track 8：Power Devices & Power IC
Chair: Long Zhang Southeast University, China
Co-Chairs: Jiafei Yao Nanjing University of Posts and Telecommunications, China Zekun Zhou University of Electronic Science and Technology of China, China
Track 9：Device Reliability & Security
Chair: Mengyuan Hua Southern University of Science and Technology, China
Co-Chairs: Junmin Jiang Southern University of Science and Technology, China Zhao Qi University of Electronic Science and Technology of China, China

Process & Technologies Subcommittee

Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Track 10：Semiconductor Process Technologies
Chair: Bobo Tian East China Normal University, China
Co-Chairs: Min Liao Xidian University, China Li Zhu Nanjing University of Posts and Telecommunications, China
Track 11：Optoelectronics and Silicon Photonics Integration
Chair: Linfeng Sun Beijing Institute of Technology, China
Co-Chairs: Ming Xu Huazhong University of Science and Technology, China Yuanfang Yu Nanjing University of Posts and Telecommunications, China
Track 12：Packaging Technologies
Chair: Jun Zhang Nanjing University of Posts and Telecommunications, China
Co-Chairs: Shenyang Mo NARI Semiconductor R&D Center, China Pengfei Zhao Nanjing University of Posts and Telecommunications, China

Contact

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