ICSICT 2026 will hold a competition with two professional tracks: Digital and Analog. One team will be selected for each award rank, with prizes of CNY 5,000 (1st), CNY 3,000 (2nd), and CNY 2,000 (3rd). All winning teams will receive certificates and one complimentary conference registration quota. We sincerely invite scholars and experts worldwide to join this competition, and contribute your wisdom to shaping the future of chips!

Please note that competition papers submitted to ICSICT 2026 will be included in the conference proceedings upon acceptance.

Digital Competition Topic: AI Agent-Based NPU Design and Verification
数字竞赛赛题：基于AI智能体的NPU设计与验证

Sponsored by: Shanghai UniVista Industrial Software Group Co., Ltd.

赞助单位：上海合见工业软件集团股份有限公司

合见工软作为自主创新的高性能工业软件及解决方案提供商，以EDA领域为首先突破方向，致力于帮助半导体芯片企业解决在创新与发展过程中所面临的严峻挑战和关键问题，并成为他们值得信赖的合作伙伴。合见工软产品线已覆盖数字芯片EDA工具、系统级工具及高速接口IP，是国内唯一一家可以完整覆盖数字芯片验证全流程，DFT可测性设计全流程，并同时提供先进工艺高速互联IP的国产EDA公司。

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Analog Competition Topic: AI Agent-Based Automatic Optimization Design of FVF LDO
模拟竞赛课题：基于AI智能体的FVF LDO自动优化设计

Sponsored by: Shenzhen Lixin Semiconductor Co., Ltd.

赞助单位：深圳砺芯半导体有限责任公司

砺芯半导体成立于2018年，是国家高新技术企业及专精特新企业，专注于ASIC芯片解决方案，深耕高性价比消费级芯片、高性能电源、电机控制、工业与车规级芯片等领域。公司总部位于深圳，在上海、成都、重庆、西安等地均设芯片设计团队。自成立以来，公司持续获得资本市场认可，迈入规模化发展的新阶段。技术团队累计申请知识产权126项，其中发明专利46项，并参与3项国家标准修订

期待与更多热爱芯片设计的青年学子交流同行，共同见证中国芯片产业的持续突破！

Learn More about the Competition (了解更多竞赛信息)